MB-60 datasheet

CPU
 •    Intel® Pentium® III (FCPGA) Processor to 1 GHz @ 100 MHz FSB
    –  Must use CPU-HS-F001V fan with above.
 •   Intel® Celeron® processor (FCPGA) to 733 MHz @ 66 MHz FSB
 •   Intel® Celeron® processor (PPGA) to 733 MHz @ 66 MHz FSB
 •   Intel® Celeron® processor (FCPGA) to 1100 MHz @ 100 MHz FSB
CHIPSET
  •  Intel® 440BX AGP chipset        
MEMORY
 •   16 MB to 384 MB memory using unbuffered DIMMs
 •   32 MB to 768 MB memory using registered DIMMs
 •   Three 168-pin DIMM sockets
 •   Uses x64 or x72 PC SDRAM, 3.3V
      –   PC-66 SDRAM DIMM for 66 MHz FSB processors
      –   PC-100 SDRAM DIMM for 100 MHz FSB processors
 •   ECC supported (uses x72 PC SDRAM DIMM)
BIOS
 •   Award BIOS, Windowsฎ 95/98/2000 Plug and Play compatible
 •   Flash EPROM for easy BIOS upgrades
 •   Supports DMI 2.0 function
 •   Includes NCR 810 SCSI BIOS
 •   Supports SCSI sequential boot-up
 •   2Mbit flash memory       
   POWER MANAGEMENT
 •   Supports ACPI specification and OS Directed Power Management
 •   Wake-On-Events include:
    –   RTC timer to power-on the system
    –   Modem ring-on
    –   Wake-On-LAN
    –   Wake-On-Keyboard
    –   Wake-On-Mouse
 •   System power management supported
 •   CPU stopped clock control
 •   Microsoftฎ/Intelฎ APM 1.2 compliant
 •   Soft Power supported - ACPI v1.0a specification
 •   AC power failure recovery
   HARDWARE MONITOR
 •    Monitors processor/system temperature
 •   Monitors 1.5V/3.3V/ฑ5V/ฑ12V/VCORE voltages
 •   Monitors processor/system fan speed
 •   Automatic processor fan control to save energy, prevent overheating,
     prolong fan life, and implement silent system
 •   Read back capability; displays temperature, voltage and fan speed          
PCI IDE  INTERFACE
 •    Supports ATA/33, ATA/66 hard drives
 •   PIO Mode 3 and Mode 4 Enhanced IDE
     (data transfer rate up to 16.6MB/sec.)
 •   Bus mastering reduces CPU utilization during disk transfer
 •   Supports ATAPI CD-ROM, LS-120, ZIP, and SCSI sequential boot-upc.)
AGP
 •   AGP supports high performance 3D graphics cards
     AGP 2x supports up to 533MB/sec. bandwidth for
     3D graphics applications
REAR PANEL I/O PORTS
 •   2 USB ports
 •   2 DB-9 serial port
 •   1 DB-25 parallel port
 •   1 mini-DIN-6 PS/2 keyboard port
 •   1 mini-DIN-6 PS/2 mouse port
 I/O CONNECTORS
 •   1 connector for IrDA interface
•   2 IDE connectors
•   1 floppy connector
•   1 20-pin ATX power supply connector
•   1 Wake-On-LAN connector
•   1 SB-LINK connector
•   3 fan connectors for CPU, chassis and AGP fans
EXPANSION SLOTS
 •  1  dedicated AGP slot
•   3 dedicated PCI slots
•   2 dedicated 16-bit ISA slots
•   1 shared PCI/ISA slot
ENVIRONMENTALS
  •   Temperature : 0ฐC to 60ฐC
  •   Relative Humidity : 10% to 90% 
PCB
 •   4 layers, ATX form factor
 •   30.5cm (12.05") x 17,2 cm (6.67")
All specifications above are subject to change without prior notice.